Products

Copper products, end to end

A single source spanning liquid copper rod, high-volume conversion products and surface-sensitive electronics-grade materials — all from controlled AMMC cathode copper.

Copper Rod & Conversion Products

Oxygen-free copper rod and high-volume conversion products drawn from AMMC cathode copper.

OF / OFE Copper Rod

OF / OFE Copper Rod

Oxygen-free copper rod from AMMC cathodes — the base liquid product and feedstock for downstream conversion. Ø8 mm is the primary commercial diameter.

  • Ø8, Ø12.5, Ø16, Ø20, Ø25 mm
  • Coils with CoA
  • Batch-level traceability
Copper Busbar

Copper Busbar

Copper busbar for electrical and power applications — cut, straightened and perforated to specification.

  • Cutting & straightening
  • Perforation
  • General-industrial grade
Copper Strip

Copper Strip

Copper strip and tape in coils, slit, rewound and packaged for shipment.

  • Slitting & rewinding
  • Coil packaging
  • Strip & tape
Rectangular Wire

Rectangular Wire

Rectangular copper wire supplied bare or with enamel / insulation.

  • Bare or insulated
  • Enamelled options
  • Profile to spec
Round Enamelled Wire

Round Enamelled Wire

Round enamelled copper wire in standard diameters and enamel classes.

  • Standard diameters
  • Multiple enamel classes
Litz Wire, Braid & Shunts

Litz Wire, Braid & Shunts

Litz wire, copper braid, shunts and current jumpers for high-frequency and flexible-conductor needs.

  • Litz wire
  • Copper braid
  • Shunts & jumpers

Electronics-Grade Materials

Surface-sensitive products manufactured under clean-transfer conditions with full traceability, supported by in-house feed preparation (drawn wire and nuggets) for ED foil and bonding.

ED Copper Foil

ED Copper Foil

Electrodeposited copper foil 1–15 µm for battery and electronics applications, including HVLP / VSP / high-frequency grades.

  • 1–15 µm thickness
  • Battery & electronics foil
  • HVLP / VSP / high-frequency
Wire Bonding / Ultrafine Wire

Wire Bonding / Ultrafine Wire

Bare and coated ultrafine copper bonding wire for interconnects in electronic components, including Pd-coated and modified grades.

  • Bare Cu bonding wire
  • Pd-coated / modified
  • Ultrafine diameters
Electronics-Grade Hub

Electronics-Grade Hub

Conversion products finished to electronics grade — E-STRIP, E-BUSBAR and E-MAGWIRE with clean packaging, coatings, CoA and extended QC.

  • E-STRIP / E-BUSBAR / E-MAGWIRE
  • Clean packaging & coatings
  • CoA + extended QC

Need a specific grade or format?

Send your specification — diameter, thickness, enamel class or foil grade — and we will confirm availability.

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